Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...
Chips are getting bigger in a bid to offer more functionality, and conversely, packages are required to house these bigger die sizes in even more compact form factors. That inevitably mandates new ...
Power integrity for today’s designs requires accurate modeling of voltage variation across die and efficient coupling between chip/package layouts in a unified platform. March 12th, 2015 - By: Chris ...
The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...
IR’s new IRS2505L power factor correction boost IC comes in a 5-pin SOT23 package for switch mode power supply, LED drivers, and fluorescent and HID electronic ballast applications. The IC features a ...
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