NAMICS Corporation remains committed to environmental stewardship, dedicated to producing high-quality, eco-friendly ...
Summary TSMC plans to construct two new wafer fabs in Kaohsiung next year, aiming to boost its 2-nanometer production capacity amid surging global demand. The expansion, part of a five-fab program, is ...
Microsoft expects to spend $80 billion on AI-enabled data centers in fiscal 2025: Summary Microsoft plans to invest $80 billion in fiscal 2025 to expand AI-focused data centers, w ...
ASML CEO Claims China's Semiconductor Industry is 10 to 15 Years Behind: Summary China's chipmakers face a 10-15 year lag due to US-led export restrictions on ASML's cutting-edge ...
China’s No 2 chip foundry Hua Hong names former Intel veteran as new president: Summary China’s Hua Hong Semiconductor has appointed ex-Intel executive Bai Peng, 62, as its ne ...
Hon Hai says it is partnering with Nvidia to develop humanoid robots: Summary Hon Hai Precision is teaming up with Nvidia to develop humanoid robots, integrating advanced AI hardw ...
Summary TSMC will begin mass production at its Arizona semiconductor fab in 2025, marking a pivotal U.S. chip manufacturing milestone. The advanced facility aims to stabilize global supply chains ...
Summary Automotive leaders from AMD, Ansys, Cadence, Rambus, and Synopsys tackled the industry's transformation in a Semi ...
Foxconn beats estimates with record fourth-quarter revenue on AI demand: Summary Foxconn, the world's largest contract electronics maker, posted record fourth-quarter revenue of T ...
Summary The U.S. launched a Section 301 investigation into China’s alleged dumping of mature-node chips, citing unfair trade practices. Analysts warn China's growing capacity could dominate global ...
Summary Canada's Critical Minerals Strategy 2024 emphasizes efforts to boost raw material production for semiconductors and EV batteries. Despite promising projects like Nechalacho and nickel ...
Summary Canon's nanoimprint lithography (NIL) technology, launched in September, promises a cost-effective alternative to EUV lithography in advanced chipmaking. By stamping circuit patterns directly ...